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High Density Interconnect HDI PCBA for Miniaturized Electronics and Advanced Packaging

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High Density Interconnect HDI PCBA for Miniaturized Electronics and Advanced Packaging

Name: High Density Interconnect HDI PCBA for Miniaturized Electronics and Advanced Packaging
Brand: Jiaqing Circuit
Price: 1 USD

Placement Accuracy : ±0.05mm

Place of Origin : China

SMD Configuration : Single-sided / Double-sided

Certification : ISO9001

Assembly Technology : Surface Mount Technology (SMT)

Price : negotiate

SMT Component Types : ICs, resistors, capacitors, BGAs

Delivery Time : 15-30 Days

Brand Name : Jiaqing Circuit

Payment Terms : L/C,D/A,D/P,T/T

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This High Density Interconnect (HDI) PCBA is designed for the most demanding miniaturized electronics applications. Featuring fine lines and spaces (0.075mm/0.075mm), micro-vias (0.1mm diameter), and multiple build-up layers, HDI technology enables significantly higher component density than conventional PCBs. This assembly is ideal for advanced smartphones, AI computing modules, memory modules, and high-performance computing applications. The HDI process incorporates sequential lamination, laser drilling, and advanced plating techniques to achieve the interconnect density required by today's most advanced semiconductor packages.

Technical Specifications

Parameter	Specification
Technology	High Density Interconnect (HDI)
Minimum Line Width/Space	0.075mm / 0.075mm
Minimum Via Diameter	0.1mm (laser microvia)
Via Types	Blind, Buried, Stacked, Staggered
Layer Structure	Sequential build-up (1+N+1, 2+N+2, etc.)
Board Types	Rigid, Flex, Rigid-Flex
Component Types	Fine-pitch BGAs, CSPs, POPs
Application Areas	Smartphones, AI modules, Memory, HPC

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