High Reliability Automotive Grade BT IC Substrate for MCU and Sensor Applications

BT IC substrate is engineered for automotive electronics requiring AEC-Q100 Grade 2 compatibility and extended temperature cycling reliability. BT resin's high glass transition temperature (180-225°C), low CTE (12-16 ppm/°C), and ultra-low moisture absorption (0.3-0.5%) provide the thermal and mechanical stability demanded by under-hood control modules, radar systems, and high-temperature environments. Available in 2-12 layer configurations with line/space down to 10/10 μm and ENIG/ENEPIG surface finishes, these substrates support wire-bond BGA packages (15*15 mm to 45*45 mm, 119-1520 balls) and FC-CSP packages for automotive MCUs, radar transceivers, and sensor fusion modules.

Automotive MCUs & ECUs

High Tg (180-225°C) and low moisture absorption ensure reliable operation in under-hood environments with extended temperature cycling (-40°C to +125°C).

Automotive Radar & ADAS

Stable dielectric properties (Dk 3.4-4.0, Df 0.004-0.010) support 77 GHz radar transceivers and ADAS sensor fusion modules.

Power Management ICs (PMIC)

Excellent thermal conductivity (0.35 W/m·K) and high decomposition temperature (≥325°C) support high-current automotive power management applications.

Wireless Connectivity (V2X, Bluetooth)

BT substrates support automotive-grade wireless MCU packages (e.g., 7*7 mm VQFN48) with wettable flanks for reliable solder joint inspection.